学生对 Arizona State University 提供的 Advanced Semiconductor Packaging 的评价和反馈
课程概述
热门审阅
RK
Mar 28, 2024
Very well deliverd and extremely pleased with the contents
BE
Feb 5, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
1 - Advanced Semiconductor Packaging 的 14 个评论（共 14 个）
创建者 lucas n
•Sep 19, 2024
As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.
创建者 Basil E
•Feb 6, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
创建者 Adokanou
•Jul 12, 2025
Complete course for IC Packaging topics
创建者 2023 1
•Mar 10, 2024
Good and Informative Course!
创建者 Dinesh R
•Mar 22, 2025
Excellent Course!
创建者 Sachin P
•Sep 21, 2024
very good
创建者 Perez C J
•Nov 1, 2024
excelent
创建者 민건희
•May 15, 2024
Good.
创建者 Swetha r G
•Sep 11, 2024
good
创建者 Sonal
•Nov 21, 2024
-
创建者 Ranganath K
•Mar 29, 2024
Very well deliverd and extremely pleased with the contents
创建者 01fe20bec164
•Oct 18, 2024
-
创建者 Boyi F
•Nov 15, 2023
I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....
创建者 Gonçalo S
•Dec 6, 2024
Should be more detailed oriented. Target public seems to be marketing