In this course, we will present atomic bonding and its relation to crystal structure and physical properties. A particular focus will be on the different types of cubic structures. There will be an introduction to planes and Miller Indices. We will discuss the principal planes in the cubic system. Their common crystallographic defects will be shown and discussed. Finally, the tensile test will be used to extract various materials parameters.


您将学到什么
Crystal Structures, Mechanical Properties of Metals, Tensile Testing, and Failures.
您将获得的技能
要了解的详细信息
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该课程共有5个模块
In this course, we will present atomic bonding and its relation to crystal structure and physical properties. A particular focus will be on the different types of cubic structures. There will be an introduction to planes and Miller Indices. We will discuss the principal planes in the cubic system. Their common crystallographic defects will be shown and discussed. Finally, the tensile test will be used to extract various materials parameters.
涵盖的内容
1个视频1篇阅读材料
The semiconductor industry requires scientists and engineers with a deep understanding of materials science and engineering. In this module, we will see a high-level overview of materials science and engineering, and learn about materials selection, materials families, types of bonding, and processing of materials.
涵盖的内容
5个视频8篇阅读材料1个作业2个讨论话题
In this module, we cover crystal structures, crystal imperfections and defects in crystals.
涵盖的内容
4个视频8篇阅读材料1个作业2个讨论话题
In this module, we will explore the mechanical properties of materials and discuss the tensile testing of materials.
涵盖的内容
6个视频8篇阅读材料1个作业2个讨论话题
In this module, you will explore mechanical properties and failure of materials.
涵盖的内容
8个视频6篇阅读材料1个作业1次同伴评审1个讨论话题
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